Fall 2012 might seem like a long way especially if you are an executive at TSMC, but that is the target for the switch to a 22nm process.  There is good news as well for 2010, we will see silicon oxynitride based 28nm at the end of June, its first high-k metal gate at the end of September and they hope to introduce low power HKMG before the end of the year.  This does put them behind Global Foundries, who were showing off actual 28nm product to Josh and Allyn. 

Then again, seeing TSMC move from the 40nm process is probably going to make a lot of partners and enthusiasts happy as we will not see the supply problems anymore.  DigiTimes can tell you all about it.


"Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to enter trial production on its 22nm high performance process node in the third quarter of 2012, and then move to the low power version in the first quarter of 2013, according to Shang-Yi Chiang, senior VP of R&D at the foundry, speaking at a forum in Yokohama"

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